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Wideband, 37 dB Isolation at 1 GHz, CMOS 1.65 V to 2.75 V, 2:1 Mux/SPDT Switches ADG918/ADG919
FEATURES Wideband Switch: -3 dB @ 4 GHz Absorptive/Reflective Switches High Off Isolation (37 dB @ 1 GHz) Low Insertion Loss (0.8 dB @1 GHz) Single 1.65 V to 2.75 V Power Supply CMOS/LVTTL Control Logic 8-Lead MSOP and Tiny 3 mm 3 mm LFCSP Packages Low Power Consumption (<1 A) APPLICATIONS Wireless Communications General-Purpose RF Switching Dual-Band Applications High Speed Filter Selection Digital Transceiver Front End Switch IF Switching Tuner Modules Antenna Diversity Switching FUNCTIONAL BLOCK DIAGRAMS
ADG918
RF1 RFC
50 RF2
CTRL 50
ADG919
RF1
RFC RF2 CTRL
GENERAL DESCRIPTION
The ADG918/ADG919 are wideband switches using a CMOS process to provide high isolation and low insertion loss to 1 GHz. The ADG918 is an absorptive (matched) switch having 50 terminated shunt legs, while the ADG919 is a reflective switch. These devices are designed such that the isolation is high over the dc to 1 GHz frequency range. They have on-board CMOS control logic, thus eliminating the need for external controlling circuitry. The control inputs are both CMOS and LVTTL
0 -10 VDD = 2.5V TA = 25 C
compatible. The low power consumption of these CMOS devices makes them ideally suited to wireless applications and generalpurpose high frequency switching.
PRODUCT HIGHLIGHTS
1. -37 dB Off Isolation @ 1 GHz 2. 0.8 dB Insertion Loss @ 1 GHz 3. Tiny 8-Lead MSOP/LFCSP Packages
-0.4 -0.6
-0.8
-1.0
INSERTION LOSS (dB)
-20
-30
-1.2 -1.4 -1.6 -1.8 -2.0 -2.2 -2.4 -2.6
ISOLATION (dB)
-40 -50 S12 -60 -70 -80 -90 S21
-2.8 -3.0
VDD = 2.5V TA = 25 C
-100 10k
100k
1M
10M 100M FREQUENCY (Hz)
1G
10G
-3.2 10k
100k
1M
10M 100M FREQUENCY (Hz)
1G
10G
Figure 1. Off Isolation vs. Frequency
Figure 2. Insertion Loss vs. Frequency
REV. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective companies.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781/329-4700 www.analog.com Fax: 781/326-8703 (c) 2003 Analog Devices, Inc. All rights reserved.
= 1.65 V to 0 V, input power all T T, noted.) ADG918/ADG919-SPECIFICATIONS1 (V specifications2.75 V,toGND =unless otherwise = 0 dBm,
DD MIN MAX
Parameter AC ELECTRICAL CHARACTERISTICS Operating Frequency3 -3 dB Frequency4 Input Power4 Insertion Loss
Symbol
Conditions
Min DC
B Version Typ2 Max 2 4 7 16 0.7 0.8 1.25
Unit GHz GHz dBm dBm dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB ns ns ns ns dBm dBm mV p-p V V V V A pF pF
S21, S12 S21, S12 S21, S12 S11, S22 S11, S22 tON tOFF tRISE tFALL P-1 dB IP3
Isolation--RFC to RF1/RF2
Isolation--RF1 to RF2 (Crosstalk) Return Loss (On Channel)4 Return Loss (Off Channel)4 ADG918 On Switching Time4 Off Switching Time4 Rise Time4 Fall Time4 1 dB Compression4 Third Order Intermodulation Intercept Video Feedthrough5
0 V dc Bias 0.5 V dc Bias DC to 100 MHz; VDD = 2.5 V 10% 500 MHz; VDD = 2.5 V 10% 1000 MHz; VDD = 2.5 V 10% 100 MHz 55 500 MHz 43 1000 MHz 34 100 MHz 54 500 MHz 39 1000 MHz 31 DC to 100 MHz 21 500 MHz 22 1000 MHz 22 DC to 100 MHz 18 500 MHz 17 1000 MHz 16 50% CTRL to 90% RF 50% CTRL to 10% RF 10% to 90% RF 90% to 10% RF 1000 MHz 900 MHz/901 MHz, 4 dBm 30
0.4 0.5 0.8 60 47 37 57 42 33 27 27 26 23 21 20 6.6 6.5 6.1 6.1 17 36 2.5
10 9.5 9 9
DC ELECTRICAL CHARACTERISTICS Input High Voltage VINH VINH Input Low Voltage VINL VINL Input Leakage Current II CAPACITANCE4 RF1/RF2, RF Port On Capacitance CTRL Input Capacitance POWER REQUIREMENTS VDD Quiescent Power Supply Current CRF ON CCTRL
VDD = 2.25 V to 2.75 V VDD = 1.65 V to 1.95 V VDD = 2.25 V to 2.75 V VDD = 1.65 V to 1.95 V 0 VIN 2.75 V f = 1 MHz f = 1 MHz
1.7 0.65 VCC 0.1 1.6 2 1.65 2.75 1 0.7 0.35 VCC 1
IDD
Digital inputs = 0 V or VDD
0.1
V A
NOTES 1 Temperature range B Version: -40C to +85C. 2 Typical values are at V DD = 2.5 V and 25C, unless otherwise stated. 3 Point at which insertion loss degrades by 1 dB. 4 Guaranteed by design, not subject to production test. 5 The dc transience at the output of any port of the switch when the control voltage is switched from high to low or low to high in a 50 test setup, measured with 1 ns rise time pulses and 500 MHz bandwidth. Specifications subject to change without notice.
-2-
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ADG918/ADG919
ABSOLUTE MAXIMUM RATINGS 1
(TA = 25C, unless otherwise noted.)
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to +4 V Inputs to GND . . . . . . . . . . . . . . . . . . -0.5 V to VDD + 0.3 V2 Continuous Current . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 mA Input Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 dBm Operating Temperature Range Industrial (B Version) . . . . . . . . . . . . . . . . -40C to +85C Storage Temperature Range . . . . . . . . . . . . -65C to +150C Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150C MSOP Package JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 206C/W
LFCSP Package JA Thermal Impedance (2-layer board) . . . . . . . . . . 84C/W JA Thermal Impedance (4-layer board) . . . . . . . . . . 48C/W Lead Temperature, Soldering (10 sec) . . . . . . . . . . . . . 300C IR Reflow, Peak Temperature (<20 sec) . . . . . . . . . . . . 235C ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 kV
NOTES 1 Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Only one absolute maximum rating may be applied at any one time. 2 RF1/RF2 Off Port Inputs to Ground .............................. -0.5 V to VDD - 0.5 V
ORDERING GUIDE
Model ADG918BRM ADG918BRM-REEL7 ADG918BCP ADG918BCP-REEL7 ADG919BRM ADG919BRM-REEL7 ADG919BCP ADG919BCP-REEL7
*Contact factory for availability.
Temperature Range -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C
Package Description Mini Small Outline Package (MSOP) Mini Small Outline Package (MSOP) Lead Frame Chip Scale Package (LFCSP) Lead Frame Chip Scale Package (LFCSP) Mini Small Outline Package (MSOP) Mini Small Outline Package (MSOP) Lead Frame Chip Scale Package (LFCSP) Lead Frame Chip Scale Package (LFCSP)
Package Option RM-8 RM-8 CP-8* CP-8* RM-8 RM-8 CP-8* CP-8*
Branding W4B W4B W4B W4B W5B W5B W5B W5B
CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the ADG918/ADG919 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
PIN CONFIGURATION 8-Lead MSOP (RM-8) 8-Lead 3 mm 3 mm LFCSP (CP-8)
VDD 1 CTRL 2 GND 3
8 RF1
PIN FUNCTION DESCRIPTIONS
Pin No. 1
Mnemonic VDD
Function Power Supply Input. These parts can be operated from 1.65 V to 2.75 V, and VDD should be decoupled to GND. CMOS or TTL Logic Level; 0 RF2 to RFC 1 RF1 to RFC Ground Reference Point for All Circuitry on the Part COMMON RF Port for Switch RF2 Port RF1 Port
ADG918/ ADG919
7 GND
6 GND TOP VIEW RFC 4 (Not to Scale) 5 RF2
2
CTRL
3, 6, 7 4 5 8
GND RFC RF2 RF1
Table I. Truth Table
CTRL 0 1
Signal Path RF2 to RFC RF1 to RFC
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ADG918/ADG919
TERMINOLOGY
Parameter VDD IDD GND CTRL VINL VINH IINL (IINH) CIN tON tOFF tRISE tFALL Off Isolation
Description
Most positive power supply potential Positive supply current Ground (0 V) reference Logic control input Maximum input voltage for Logic 0 Minimum input voltage for Logic 1 Input current of the digital input Digital input capacitance Delay between applying the digital control input and the output switching on. Delay between applying the digital control input and the output switching off. Rise time. Time for the RF signal to rise from 10% to 90% of the ON level. Fall time. Time for the RF signal to fall from 90% to 10% of the ON level. The attenuation between input and output ports of the switch when the switch control voltage is in the OFF condition. Insertion Loss The attenuation between input and output ports of the switch when the switch control voltage is in the ON condition. 1 dB compression point. The RF input power level at which the switch insertion loss increases by 1 dB over its P-1 dB low level value. It is a measure of how much power the ON switch can handle before the insertion loss increases by 1 dB. Third order intermodulation intercept. This is a measure of the power in false tones that occur when closely spaced IP3 tones are passed through a switch, whereby the nonlinearity of the switch causes these false tones to be generated. Return Loss The amount of reflected power relative to the incident power at a port. Large return loss indicates good matching. By measuring Return Loss the VSWR can be calculated from conversion charts. VSWR (voltage standing wave ratio) indicates degree of matching present at a switch RF port. Video Feedthrough Spurious signals present at the RF ports of the switch when the control voltage is switched from high to low or low to high without an RF signal present.
-4-
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Typical Performance Characteristics-ADG918/ADG919
-0.2 -0.4 -0.6 -0.8 -1.0 -1.2 -1.4 -1.6 -1.8 -2.0 -2.2 -2.4 -2.6 -2.8 -3.0 -3.2
-0.30 -0.35 VDD = 2.5V VDD = 2.75V
INSERTION LOSS (dB)
VDD = 2.25V
VDD = 2.5V
INSERTION (dB)
-0.40
-0.45 -0.50 -0.55 -0.60 -0.65 -0.70 VDD = 2.25V
VDD = 2.75V
TA = 25 C 10k 100k 1M 10M 100M FREQUENCY (Hz) 1G 10G
-0.75 -0.80 10k
TA = 25 C 100k 1M 10M 100M FREQUENCY (Hz) 1G 10G
-0.2 -0.4 -0.6 -0.8 VDD = 1.8V VDD = 1.65V -1.0 -1.2 -1.4 -1.6 -1.8 -2.0 -2.2 -2.4 VDD = 1.95V -2.6 -2.8 TA = 25 C -3.0 -3.2 10k 100k 1M 10M 100M 1G FREQUENCY (Hz)
INSERTION LOSS (dB)
10G
TPC 1. Insertion Loss vs. Frequency over Supplies (RF1/RF2, S12, and S21)
TPC 2. Insertion Loss vs. Frequency over Supplies (RF1/RF2, S12, and S21) (Zoomed TPC 1 Plot)
TPC 3. Insertion Loss vs. Frequency over Supplies (RF1/RF2, S12, and S21)
-0.2 -0.4 -0.6 -0.8 +25 C +85 C -1.0 -1.2 -1.4 -1.6 -1.8 -2.0 -2.2 -2.4 -2.6 -2.8 VDD = 2.5V -3.0 -3.2 10k 100k 1M 10M 100M FREQUENCY (Hz)
0
-40 C
-10
VDD = 1.65V TO 2.75V TA = 25 C
-20
0 V = 1.65V TO 2.75V -10 T DD 25 C A= -20 -30
INSERTION LOSS (dB)
ISOLATION (dB)
-30
ISOLATION (dB)
-40 -50 -60 -70 S12
-40 -50 S12 -60 -70 -80
-80 S21
1G 10G
-90 1G 10G -100 10k 100k
S21 1M 10M 100M FREQUENCY (Hz) 1G 10G
-90 10k
100k
1M 10M 100M FREQUENCY (Hz)
TPC 4. Insertion Loss vs. Frequency over Temperature (RF1/RF2, S12, and S21)
TPC 5. Isolation vs. Frequency over Supplies (RF1/RF2, ADG918)
TPC 6. Isolation vs. Frequency over Supplies (RF1/RF2, ADG919)
-10
0
VDD = 2.5V
-20
-30
ISOLATION (dB)
TA = 25 C -5 VDD = 2.5V
-10
RETURN LOSS (dB)
-40 -50 -60 -70 -80 -90 S12 (-40 C) S21 (-40 C, +25 C, +85 C) 100k 1M 10M 100M FREQUENCY (Hz) 1G 10G S12 (+85 C)
-20 -25 -30 -35 -40 10k ON SWITCH
S12 (+25 C)
-100 10k
100k
1M 10M 100M FREQUENCY (Hz)
1G
10G
X-TALK (dB)
-15
OFF SWITCH (ADG918)
-10 -15 TA = 25 C -20 VDD = 2.5V -25 -30 -35 -40 -45 -50 -55 -60 -65 -70 -75 -80 10k 100k 1M 10M 100M FREQUENCY (Hz)
1G
10G
TPC 7. Isolation vs. Frequency over Temperature (RF1/RF2, ADG919)
TPC 8. Return Loss vs. Frequency (RF1/RF2, S11)
TPC 9. Crosstalk vs. Frequency (RF1/RF2, S12, S21)
REV. 0
-5-
ADG918/ADG919
40
CH1
35 30 25 20 15 10
CH1 = CTRL = 1V/DIV CH2 = RF1 = 100mV/DIV CH3 = RF2 = 100mV/DIV TRISE = 6.1ns TFALL = 6.1ns
CH1 500mV CH2 1mV
CH2/3
CTRL
RFC
IP3 (dBm)
CH2 p-p 2.002mV m 10.0ns
5 0 250
VDD = 2.5V TA = 25 C 350 450 550 650 750 FREQUENCY (MHz) 850
TPC 10. Switch Timing
TPC 11. Video Feedthrough
TPC 12. IP3 vs. Frequency
20 18 16 14
P-1dB (dBm)
12 10 8 6 4 2 0 0 250 500 750 1000 1250 1500 FREQUENCY (MHz) VDD = 2.5V TA = 25 C
TPC 13. P-1dB vs. Frequency
-6-
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ADG918/ADG919 Test Circuits*
0.1 F
VDD 0.1 F
VDD
VDD
VDD
ADG919
RF1 50
RL 50
VOUT
RFC
RFx RL 50 GND
VOUT VCTRL VOUT 50% 50%
RFC
NETWORK ANALYZER
VS
CTRL
CTRL
90% 10%
RF2
50
VS
VCTRL
GND INSERTION LOSS = 20log VOUT VS
t ON
t OFF
Test Circuit 1. Switching Timing: tON, tOFF
0.1 F
Test Circuit 4. Insertion Loss
VDD
0.1 F
VDD
VDD
ADG919
RF1
NETWORK ANALYZER 50
VDD RFC RFx VOUT VCTRL VS CTRL GND RL 50 VOUT 10% 90% 90% 10%
RFC
VS
50%
50%
50 CTRL RF2 RL 50 VOUT
VCTRL
GND VOUT VS
t RISE
t FALL
CROSSTALK = 20log
Test Circuit 2. Switch Timing: tRISE, tFALL
VDD 0.1 F
Test Circuit 5. Crosstalk
VDD 0.1 F
VDD
ADG919
RF1
50
VS VOUT
VDD
ADG919
RF1 NC
RFC
RL 50
OSCILLOSCOPE
RFC NC
CTRL
RF2
50
NETWORK ANALYZER
VCTRL
CTRL
RF2
VCTRL
GND OFF ISOLATION = 20log VOUT VS
GND
Test Circuit 3. Off Isolation
Test Circuit 6. Video Feedthrough
*Similar setups for ADG918. REV. 0 -7-
ADG918/ADG919
VDD 0.1 F 0.1 F VDD
VDD
ADG919
RF1 50 RF SOURCE
VDD
ADG919
RF1 50
SPECTRUM ANALYZER
RFC COMBINER
SPECTRUM ANALYZER
RFC RF SOURCE VS GND
CTRL
RF2
CTRL RF SOURCE
RF2
VCTRL
GND
VCTRL
Test Circuit 7. IP3
Test Circuit 8. P-1dB
-8-
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ADG918/ADG919
APPLICATIONS Filter Selection
The ADG918/ADG919 are ideal solutions for low power, high frequency applications. The low insertion loss, high isolation between ports, low distortion, and low current consumption of these parts make them excellent solutions for many high frequency switching applications. The most obvious application is in a transmit/receive block, as shown in the wireless metering block diagram in Figure 3. Other applications include switching between high frequency filters, ASK generator, FSK generator, and antenna diversity switch in many tuner modules.
Absorptive vs. Reflective
The ADG919 can be used as a 2:1 demultiplex to switch high frequency signals between different filters and also to multiplex the signal to the output.
RF1 RF2 RF1 RF2
RFIN
RFC
ADG919
ADG919
RFC
RFOUT
Figure 5. Filter Selection
ADG9xx EVALUATION BOARD
The ADG918 is an absorptive (matched) switch with 50 terminated shunt legs, and the ADG919 is a reflective switch with 0 terminated shunts to ground. The ADG918 absorptive switch has a good VSWR on each port, regardless of the switch mode. An absorptive switch should be used when there is a need for a good VSWR that is looking into the port but not passing the through signal to the common port. The ADG918 is therefore ideal for applications that require minimum reflections back to the RF source. It also ensures that the maximum power is transferred to the load. The ADG919 reflective switch is suitable for applications where high off port VSWR does not matter and the switch has some other desired performance feature. It can be used in many applications, including high speed filter selection. In most cases, an absorptive switch can be used instead of a reflective switch, but not vice versa.
Wireless Metering
The ADG9xx evaluation board allows designers to evaluate the high performance wideband switches with a minimum of effort. To prove that these devices meet the user's requirements, the user only requires a power supply and a network analyzer along with the evaluation board. An application note is available with the evaluation board and gives complete information on operating the evaluation board. The RFC port (see Figure 6) is connected through a 50 transmission line to the top left SMA connector J1. RF1 and RF2 are connected through 50 transmission lines to the top two SMA connectors J2 and J3, respectively. A through transmission line connects J4 and J5 and this transmission line is used to estimate the loss of the PCB over the environmental conditions being evaluated. The board is constructed of a 4-layer, FR4 material with a dielectric constant of 4.3 and an overall thickness of 0.062 inches. Two ground layers with grounded planes provide ground for the RF transmission lines. The transmission lines were designed using a coplanar waveguide with ground plane model using a trace width of 0.052 inches, clearance to ground plane of 0.030 inches, dielectric thickness of 0.029 inches, and a metal thickness of 0.0014 inches.
The ADG918 can be used in wireless metering applications. It can be used in conjunction with the ADF7020 transceiver IC for a utility metering transceiver application, providing the required isolation between the transmit and receive signals. The SPDT configuration isolates the high frequency receive signal from the high frequency transmit.
LNA ANTENNA
ADG918
TX/RX SWITCH PA
Figure 3. Wireless Metering
Tuner Modules
The ADG918 can be used in a tuner module to switch between the cable TV input and the off-air antenna. This part is also ideal for use as an antenna diversity switch, switching different antenna to the tuner.
Figure 6. ADG9xx Evaluation Board Top View
ADG918/ ADG919 TUNER
VGA ANTENNA CABLE
Figure 4. Tuner Modules
REV. 0
-9-
ADG918/ADG919
OUTLINE DIMENSIONS 8-Lead Mini Small Outline Package [MSOP] (RM-8)
Dimensions shown in millimeters
3.00 BSC
8
5
3.00 BSC
1 4
4.90 BSC
PIN 1 0.65 BSC 0.15 0.00 0.38 0.22 COPLANARITY 0.10 1.10 MAX 8 0 0.80 0.60 0.40
0.23 0.08 SEATING PLANE
COMPLIANT TO JEDEC STANDARDS MO-187AA
8-Lead Lead Frame Chip Scale Package [LFCSP] 3 mm 3 mm Body (CP-8)
Dimensions shown in millimeters
0.50 0.40 0.30 PIN 1 INDICATOR 0.45 PIN 1 INDICATOR
8 1
3.00 BSC SQ
0.60 MAX
TOP VIEW
2.75 BSC SQ 0.50 BSC 0.25 MIN 0.05 MAX 0.02 NOM
5
BOTTOM VIEW
4
1.50 REF
1.90 1.75 1.60
0.90 0.85 0.80
12 MAX
0.80 MAX 0.65 TYP
1.60 1.45 1.30
SEATING PLANE
0.30 0.23 0.18
0.20 REF
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REV. 0
-11-
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C03335-0-8/03(0)

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